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Fig. 6 | AMB Express

Fig. 6

From: Enhanced resistance to heat and fungal infection in transgenic Trichoderma via over-expressing the HSP70 gene

Fig. 6

Analysis of heat resistance in TvHSP70-OE engineered strains and WT strains under various heat treatments. (a) Plate growth and (c) colony diameter of transgenic and WT strains under constant heat stress (35℃ and 37℃). (b) Plate growth and (d) colony diameter of transgenic and WT strains under short-term exposure to heat stress (37℃, 40℃, 43℃, 46℃ and 49℃). (e) Mycelia morphology of transgenic and WT strains under various heat treatments; scale bar = 10 μm. WT: wild type; TvHSP70‑OE: TvHSP70 overexpressing; OE-5, OE-7 and OE-11: transgenic strains with over-expressed TvHSP70; Data are presented as mean ± S.E. of triplicate experiments; Columns with different letters indicate significant differences at P < 0.05 (Duncan’s test); * and ** indicate a significant difference from that of WT at P < 0.05 and < 0.01, respectively

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